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Sputter Source
Product Specifications
<| Division | Single planar cathode | Dual planar cathode |
| Power supply | DC, Pulse DC, RF | DC, Pulse DC, Bipolar Pulse DC, AC |
| DDR(*) | ≥ 150nmㆍm/min @Cu | ≥ 300nmㆍm/min @Cu |
| ≥ 30nmㆍm/min @ITO | ≥ 50nmㆍm/min @ITO | |
| Target consumption efficiency | ≥ 35% | ≥ 35% |
| Backing plate | Direct / Indirect cooling type | |
| Magnet construction | Static / Moving magnet 방식 | |
| Max. target length | 2,500mm | |
| Applied equipment | In-line / R2R / Cluster / coating equipment for general industry | |