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Sputter Source
Product Specifications
<Division | Single planar cathode | Dual planar cathode |
Power supply | DC, Pulse DC, RF | DC, Pulse DC, Bipolar Pulse DC, AC |
DDR(*) | ≥ 150nmㆍm/min @Cu | ≥ 300nmㆍm/min @Cu |
≥ 30nmㆍm/min @ITO | ≥ 50nmㆍm/min @ITO | |
Target consumption efficiency | ≥ 35% | ≥ 35% |
Backing plate | Direct / Indirect cooling type | |
Magnet construction | Static / Moving magnet 방식 | |
Max. target length | 2,500mm | |
Applied equipment | In-line / R2R / Cluster / coating equipment for general industry |